Interflux® 1.0mm Sn63Pb37 No-Clean Solder Wire | 500 g
The No-Clean Solder Wire IF-NC-91 is developed as the final solution to eliminate the use of solvents for cleaning in the electronics industry.
The IF-NC-91 Flux integrates into the electronics industry as a complement to the newer generations of Low Residue Liquid Fluxes.
The IF-NC-91 Flux Formula leaves minimal residues and makes cleaning completely unnecessary.
Its excellent wetting and fluxing activities allow the residues to remain without the need of removal, and yet comply with the IPC J-STD-004B test requirements.
No-Clean Solder Wire - A very high graded flux cored solder wire.
Smoother, Stronger, Shiner Joints - It creates better solder joints with through hole penetration and good top side fill formation.
Non-Conductive, Non-Corrosive - The flux residues on the wire is non-conductive and non-corrosive to metal parts which enables it use as a no-clean solder wire. However, cleaning may be done using solvent cleaner if post residue removal is desired.
Excellent Performance - Provides excellent performance for automatic and hand soldering in the industry.
Low Dross Rate - Makes it economical to use.
Specifications Model IF-NC-91-1.0
Specific Gravity (gm/cm3) 8.40 Diameter 1.0 mm Melting Range 183°C / 183-191°C Wire Length Per Kg 171.8m (approximate) Spool Size 500 g
Country of Origin Singapore
- State : Tack-Free Hard Solid
- Color : Clear Transparent
- Specific Gravity @ 20°C : 1.085
- Flux Content (% by weight) : 2.0 (+ 0.2)
- Flux Classification (J-STD-004) : ROL0
- Silver Chromate Paper Test : No discolouration
- Copper Plate Corrosion (J-STD-004) : Passed
- Surface Insulation Resistance (in ohm) : > 1 x 1012
- Spreading Coefficient (in %) : > 92%
Package Contents Item
IF-NC-91-1.0 500 g Download Product Catalog
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