Soder-Wick® Chemtronics SW16035 No Clean Desoldering Wick | (L) 1.5 m x (W) 2.03 mm

ChemtronicsSKU: SW16035

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  • Sold By - Otovon Electronics Private Limited
  • Address - 42A, Upper Ground Floor Back Side, KH No. 40/15 Abchal Nagar, Nilothi Extension, Delhi, IN - 110041
  • E-mail -
  • Phone - 9315187923
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Soder-Wick® Chemtronics 60-3-5 No Clean Desoldering Wick | (L) 1.5 m x (W) 2.03 mm

Soder-Wick® No Clean desoldering wick is designed to provide fast and safe desoldering without leaving behind harmful flux residues.

Soder-Wick® No Clean desoldering wick uses pure, oxygen-free copper braid and a patented flux technology to make an efficient and effective desoldering braid.

Soder-Wick® No Clean desoldering wick is available on ESD safe bobbins for protection against damage due to static electricity.

All wick is sealed in nitrogen-purged ing to avoid corrosion and loss of performance from moisture and oxygen.

  • Soder-Wick® No Clean packaged in ESD-safe static dissipative bobbins
  • Minimizes the risk of damage associated with static electricity
  • Patented noncorrosive, halide free, organic no-clean flux
  • Desolders up to 40% faster than competitive no-clean braids and leaves boards cleaner
  • Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for Surface Insulation Resistance

MIL-F-14256 F
NASA-STD-8739.3 Soldered Electrical Connections
DOD-STD-883E, Method 2022
Meets MIL-STD-883B, Bellcore TR-NWT-000078, ANSI/IPC J SF-818
Meets parameters tested by the Singapore Institute of Standards and Industrial Research (SISIR) for Solderabilit

Model SW16035
Type No Clean SD
Length 1.5 m
Width 2.03 mm
Weight 5 g
Warranty NA
Brand Soder-Wick
Country of Origin United States
  • Soder-Wick® No Clean SD safely removes solder in all applications requiring Type ROL0 flux
  • BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes
Package Contents
Item Quantity
1 N

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