Techspray® 1823-5F No-Clean Desoldering Wick - ESD Safe

Save 21%
TechspraySKU: 0000865

Sale price₹236.00 Regular price₹300.00

(Inclusive of GST) M.R.P.

  Save Extra with offers
Free Shipping: On Prepaid Cart Value of ₹1499/- and above.
Business Purchases: Get GST Invoice and Save up to 28%.

  • GST Tax Invoice - Available, Provide GST Number at Checkout to Get Tax Input
  • Sold By - Otovon Electronics Private Limited
  • Address - 42A, Upper Ground Floor Back Side, KH No. 40/15 Abchal Nagar, Nilothi Extension, Delhi, IN - 110041
  • E-mail -
  • Phone - 9315187923
  • WhatsApp - Click Here


Techspray® 1823-5F No-Clean Desoldering Wick | (L) 1.5 m x (W) 2.5 mm

Techspray No-Clean desoldering braid (wick) does not leave behind ionic flux residues that can collect and form branches called “dendrites”. Other fluxes, if not cleaned properly, can cause dendrites that grow over time and eventually cause short circuits between traces or leads. Latent failures lead to costly returns and lower the quality perception of your products.

Desoldering braid or desoldering wick is a pre-fluxed copper braid that is used to remove solder, which allows components to be replaced and excess solder (e.g. bridging) to be removed. The soldering iron is applied to the wick as it sits on the solder joint, and when both are brought up to the solder's melting point, the flux is activated and, through capillary action from the braided design, solder is drawn up the wick. Techspray wick has been a mainstay at PCB rework, repair and prototyping stations for over 30-years.
Available in anti-static spools to prevent static build-up from damaging sensitive components.

Meets or Exceeds MIL-F-14256

NASA NHB 5300, 4 (34-1)

NASA NPC 200-4


IPC Standard-J-STD-004 


  • No-clean flux coated braid
  • Cleanest wick - clear, non-reactive residues
  • Will not leave ionic residue -- avoid dendrite failure
  • Exceeds MIL-F-14256
Model 1823-5F
Type No-Clean
Length 1.5 m
Width 2.5 mm
Weight 5 g
Warranty NA
Brand Techspray
Country of Origin United States
  • No-Clean removes solder in all applications
  • BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes
Package Contents
Item Quantity
1 N

Download Technical Data Sheet

Download Safety Datasheet (SDS)

Customer Reviews

Be the first to write a review

You may also like

Recently viewed