Techspray® 1823-5F No-Clean Desoldering Wick - ESD Safe

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TechspraySKU: 0000865

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Sale price₹ 236.00 INR Regular price₹ 300.00 INR

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  • Sold By - Otovon Electronics Private Limited
  • Address - 42A, Upper Ground Floor Back Side, KH No. 40/15 Abchal Nagar, Nilothi Extension, Delhi, IN - 110041
  • E-mail - support@otovon.in
  • Phone - 9315187923
  • WhatsApp - Click Here

Pickup available at Delhi_The White House

Обычно готов за 24 часа

Description

Techspray® 1823-5F No-Clean Desoldering Wick | (L) 1.5 m x (W) 2.5 mm

Techspray No-Clean desoldering braid (wick) does not leave behind ionic flux residues that can collect and form branches called “dendrites”. Other fluxes, if not cleaned properly, can cause dendrites that grow over time and eventually cause short circuits between traces or leads. Latent failures lead to costly returns and lower the quality perception of your products.

Desoldering braid or desoldering wick is a pre-fluxed copper braid that is used to remove solder, which allows components to be replaced and excess solder (e.g. bridging) to be removed. The soldering iron is applied to the wick as it sits on the solder joint, and when both are brought up to the solder's melting point, the flux is activated and, through capillary action from the braided design, solder is drawn up the wick. Techspray wick has been a mainstay at PCB rework, repair and prototyping stations for over 30-years.
 
Available in anti-static spools to prevent static build-up from damaging sensitive components.

Meets or Exceeds MIL-F-14256

NASA NHB 5300, 4 (34-1)

NASA NPC 200-4

NASA SP5002

IPC Standard-J-STD-004 

Features

  • No-clean flux coated braid
  • Cleanest wick - clear, non-reactive residues
  • Will not leave ionic residue -- avoid dendrite failure
  • Exceeds MIL-F-14256
Specifications
Model 1823-5F
Type No-Clean
Length 1.5 m
Width 2.5 mm
Weight 5 g
Warranty NA
Brand Techspray
Country of Origin United States
Applications
  • No-Clean removes solder in all applications
  • BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes
Package Contents
Item Quantity
1823-5F
1 N

Download Technical Data Sheet

Download Safety Datasheet (SDS)









































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